21st International Conference on Electronic Commerce
(ICEC 2019)

Busan, Korea, July 3-5, 2019

Intro to Busan

CALL FOR PAPERS

Call for Paper Download

The 21st International Conference on Electronic Commerce (ICEC 2019) will be held in Busan, Korea, on July 3-5, 2019. ICEC 2019 aims at providing researchers and practitioners in electronic commerce and related areas with an opportunity to present original ideas and share insightful opinions. The theme of ICEC 2019 is “FinTech and Logistics in the Fourth Industrial Revolution Era.”

We welcome submissions of original research papers addressing issues concerning the theory, design, development, evaluation, and application of electronic commerce and related fields. We also encourage submissions of research-in-progress contributions that are innovative and inspirational. Research articles particularly sought after are those motivated by real-world business problems and validated using rigorous research methodologies. For more information and program updates, please visit http://icec.net.

[Publication Policy] We encourage authors to submit full papers or extended abstracts of research-in-progress, however since 2018, we will publish only the abstract without making formal conference proceedings to leave the author’s copyright of publishing the papers in the international journals. Past ICEC proceedings can be found at www.ACM.org.

The submitted papers will be the base of selecting the best papers and invitation to special issue of the journals such Electronic Commerce Research (SSCI), Electronic Commerce Research and Application (SSCI), Transportation Research-Part E: Logistics and Transportation Review (SSCI) Sustainability (SSCI), Information Technology for Development (SSCI),  APJIS (Scopus). If a paper is invited to the special issue of the above journals ICEC2019, then a revised paper will be submitted to the guest editors, where it will undergo a second-round review. The presentation at ICEC2019 will be not only a good channel to publication, but also a good opportunity to get constructive comments for the authors to further develop work-in-progress research. Relevant topics include, but are not limited to, the following:

– Fintech
– e-commerce in Asia Pacific
– Logistics
– Smart Factory and Manufacturing
– Cross-border e-commerce – Mobile and Social Commerce
– AI in Accounting, Banking, and Finance – Social Media and Social Networking
– Internet-of-Things for Business – Emerging Financial Technology (Fintech)
– AI for e-Commerce and Wellness – Smart Health & Hospitals
– Big Data and Machine Learning in e-Commerce – Smart Tourism and Smart Logistics
– Smart Connected Services – AI for Business Communication
– Entertainment, Virtual Reality and Augmented Reality – Bright Internet and Cybersecurity
– Smart Connected Products and Services – Education in Cyberspace
– Smart and Wearable Technologies – Online-to-offline Services in e-Commerce
– Cloud Services and Service Innovation – Digital Twin
– Edge Computing – Immersive Experience
– Cobots and Logistics – Event-Based Models
– Block Chain, Cryptocurrency, and Token Economy – Decentralized/Peer-to-Peer e-Commerce
– AI in Marketing and Sales – Chatbot and Conversational Agents

PAPER SUBMISSION

  1. The Submitted papers must be original work. A paper with substantial overlap with the submission must neither be already published, nor be currently under review for publication in any other venue.
  2. All submissions will be handled at https://easychair.org/conferences/?conf=icec2019 that can be accessed through www.ICEC.net.
    The official ACM Proceedings format is available as a template in Word format (pubform_icec2019). If you cannot reach the link of the template,  please, click here for Baidu Cloud.
  1. All submissions must be in English. Each paper is limited to 8 pages including figures and references. Please download the Manuscript Templates for Conference from the conference website: www.ICEC.net.
  2. Both full papers and abstracts are welcome.

IMPORTANT DATES
Deadline for paper submission: Feb 28, 2019 -> Mar 31, 2019
Notification of acceptance: April 1, 2019 -> April 15, 2019
Deadline for final camera-ready version of accepted papers: May 1, 2019 -> May 30, 2019

Conference Venue
The conference will be organized in Haeundae Grand Hotel located at Haeundae beach, which is often considered one of Korea’s most famous and beautiful beaches.

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Address: Haeundae-Beach Road 217, Haeundae-gu, Busan, Republic of Korea
Tel. +82 (0)51 7400 114, www.haeundaegrandhotel.com 

Hosted by
International Center for Electronic Commerce (ICEC, https://icec.net )
Pusan National University Institute of China Studies (PNUICS, https://pnuchinese.pusan.ac.kr)

Conference Chairs
Hyung Rim Choi, Dong-A University (hrchoi@dau.ac.kr), Korea
Paul Tae-Woo Lee, Zhejiang University, China
Thomas A. Weber, Swiss Federal Institute of Technology, Lausanne, Switzerland
Qi Li, Xi’an Jiaotong University, China

Program Chairs
Taeho Hong, Pusan National University (hongth@pusan.ac.kr), Korea
Youngki Park, George Washington University, USA
Jian Mou, Xidian University, China

Organizing Chairs
Soon-Goo Hong, Dong-A University (shong@dau.ac.kr), Korea
Tae Ho Song, Pusan National University (thsong@pusan.ac.kr), Korea
Xianfeng Zhang, Hainan Normal University, China
Kai Li, Nan Kai University, China
Dan J. Kim, University of North Texas (dan.Kim@unt.edu), USA

Local Organizing Chairs
Hyun Soo Kim, Dong-A University, Korea
Kangbae Lee, Dong-A University, Korea

Tutorial Chair
Byung Kwon Park, Dong-A University, Korea

Steering Committee
Jae Kyu Lee, KAIST, Korea & SUSTech, China
Robert Kauffman, Singapore Management University, Singapore
Zhangxi Lin, Texas Tech University, USA
Kyoung Jun Lee, Director of ICEC Center & Kyung Hee University, Korea
Sung-Byung Yang, Kyung Hee University, Korea

Program Secretariat
Minje Cho, Dong-A University, Korea (mjcho@dau.ac.kr)

Conference Secretariat
Miri Heo, International Center for Electronic Commerce, Korea (contact@icec.net)

* July 3 – 4, 2019: Plenary and technical paper sessions.
* July 5, 2019: Industry tour program.

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